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I recently got asked for some tips on this upgrade and figured others could benefit from the info as well. So for posterity, here's what I recall as being the most relevant info, condensed. There's 2 important topics to get right which require some strategy: alignment needs to be dead-on, and the interposer needs some help to be mounted flat. I'll explain why. For alignment, generally you can be just under half a pitch off with your BGA alignment and it'll work out fine when the chip settles. So, the BGA pitch on this motherboard of 1.25mm suggests alignment is very forgiving. However, vias centered within groups of pads are not nicely tented, and instead take up most of the leeway you'd normally have with alignment. I'd say you don't have ~0.6mm of tolerance, but rather about 0.15mm. To assure I get good alignment, the first thing I do is eliminate the possibility of bridges forming between the BGA pads and nearby vias. You can simply tent these vias manually using UV curable solder mask. Takes about 10-15 minutes, and with this, a lot of alignment margin is recovered. At the same time, I place some 0603 resistors near corners of the BGA array and interposer outline. See the red marked circles below. The BGA pads on the underside of the interposer do not cover the entire interposer area, so the interposer tends to tilt/slant during reflow because it's gravity center is off. When the interposer is tilted, BGA balls can get too compressed and are unnecessarily stressed. Now the 0603 resistors just happen to have a height very similar to properly compressed 0.76mm solder balls, so this very simple approach ensures the interposer will get mounted flat. Next, my definitive way to get perfect alignments, after a number of less precise prior attempts: I drilled through the corner BGA pads on the underside of a sacrificial interposer. See circles in picture below. The resulting holes allows to see the xbox BGA pads underneath, and thereby align the sacrificial interposer perfectly. Then, I tape it down temporarily. The next step is to fix this interposer in place. The idea is that by placing e.g. 0805 capacitors along the edges of this interposer, we can lift it up and replace it with a fresh interposer in exactly the same position. Furthermore, because the interposer cannot move laterally, the interposer won't "dance", and therefore balls cannot join with the vias centered within groups of pads either. With the alignment also being spot on, there shouldn't be a "snap" when the BGA aligns itself due to surface tension either. I believe this thoroughly eliminates everything that could potentially yield faulty mounts. The very last optimization I added was to place a single case screw diagonally over the interposer as depicted above. This counteracts the weight imbalance due to the BGA pads being off-center underneath the interposer. The positioning I found is determined experimentally and results in the interposer settling down perfectly straight, i.e. all 4 corners go simultaneously. This isn't super important since we already guarantee flat mounts due to the 0603 resistors acting as standoffs from a prior step. Running short on time for this writeup so I'll conclude with the only other vital step: use a bismuth compound solder paste for the CPU itself. Bismuth solder has much lower melting point than normal leaded, so this allows soldering of the CPU without inadvertently reflowing the interposer (but with a lot of added weight on top, potentially squashing the balls!).

This tool is released, it's called Repackinator. You can download repackinator from the team resurgent github page. https://github.com/Team-Resurgent/Repackinator Just use untouched redump iso files and the program will do the rest. It will also create the attach file. the main repacklist.json in repackinator is fully tested and is build like so: all usa games + pal exlusives + jap exlusives. If you wish to convert another version of the game for some reason you can add it to the repacklist.json (you can find the alt games in altRepacklist.json) Here is a compatibility list for xiso with cerbios: https://docs.google.com/spreadsheets/d/e/2PACX-1vTsVPLdUJvc0R8oYXbx5xVSEBHW98VH2xM5XkvODvC01Sbcj9b3I2laWD3ZxN-Yklm4qJR2jF4nXuiu/pubhtml?gid=0&single=true And here is the compatibility for CCI (cerbios compressed images): https://docs.google.com/spreadsheets/u/1/d/e/2PACX-1vSewa5ynfmFC6Dg9FeF9nBF511dGgHc6VwtmR5AH3yyba-bqXO2OAvR-_xxPSLk84xCiM8LxntTYzHX/pubhtml?gid=0&single=true

Dustin/MakeMHz, has stated that they’re working on compatibility with the old XLCD screens AND, the STL has been released for the faceplate along with the X3CP board being successfully cloned. I think it’s safe to say that It’s only a matter of time now. Glad I still have the old X3 lying around. In other news, my Stellar just arrived today.

Format the ipod nano again using FATXplorer 3.0 beta then copy the two save files / numbered folders to the root / top-level folder. Edit: Forget that you ever knew that the old buggy Xplorer360 application ever existed.

Not 100% on this, as was not even aware you could do this with a nano. It sounds a bit like file permissions, the NT file system which fatx is based on can be a bit picky. What you could try is make a real splintershell save by playing the game enough to get to a save point. Then on your computer delete all the files in side the save, not the folders just the files then from your hacked save copy all the contents into their respective folders. Pop that into the XBox and see if it likes it. He folders will grant the implied permissions on your transplanted files.