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This is my frist time working with a Tsop im looking for advice ik i got 1..0 1.1 versions does this wire need to be a single copper or can it be threaded also hexen i can find but a bios checker i can not fine any where

I cloned the stock drive on my softmodded Xbox to a 500gb drive that was in my dead TSOP xbox using Chimp and locked it. The drive boots up just fine. I then use HeXEn disc to install Krayzie One Click softmod, and that was successful. I reboot into HeXEn, and I can see the F and G, but F looks empty in the file explorer (it says F has 35mb free, when it should be about 20GB free), and G says there is 0 space free. G doesn't even show up in UnleashX even though F and G are enabled. How can I get the contents of F and G to show up? I really dont want to have to reformat F and G/re-transfer everything if I can avoid it.

Can someone please confirm that only the Pads at R7D3 (on the top of the board) and the Pads at R7R3 (on the bottom of the board) need to be soldered and there is no jumper wire or other modifications needed if the TSOP is a Winbond TSOP and not a Sharp TSOP.

Only recently ive been looking at this manufacturing proces part where they get the kernel on the motherboard. "our" Blake Clements @OGXbox Admin linked me at facebook to the following url: http://www.ogxbox.com/archive/xboxsecurity.html look at the Modchip part. It states that But I do not know if this is said based on the observation mentioned or based on internal Microsoft or flextronics manufacturing personal. Blake also said that: So, the LPC port was used for programming? A bed of nails (pogo pins) should and probably be used to connect the write enable pins on the motherboard to enable the flash writing of the then onboard tsop. I do not know for sure if this is posible but I rather for now asume it was. because we cant flash tsop today whne the xbox has been booted from LPC (modchip boots can only flash modchip, not the tsop, even of you remove the modchip prior to flashing) Connecting to lpc and connecting the write enable lines using pogopins could be done, altho I dont know how they would write to flash from LPC. the MCPX doesnt allow flash write in a LPC boot right? maybe a unkown mode? anyway, pure onboard tsop writing by connecting to the tsop directly would be a pain, but posible with fine pitched pins. not sure if the board would allow that with the mcpx on the same wires. All logic I can come up with is that MS would send their kernel to the tsop manufactorer and let them preprogram all tsops before soldering. then at the factory MS could use a bed of pogopins and a "recovery disk" to install a newer kernel if they wanted as long as the xbox booted from tsop. any other sources or interviews that claim or verify either side are welcome. movies and pictures of this proces too. most details I know came or will be added to: http://xboxdevwiki.net/Manufacturing_Process

use an eprom (27C2001/27C020 or bigger) or flashrom (29F020 or bigger) connect pins 22, 24 and 31 of the eprom to GND (pin 16 of the eprom). you might have to connect 31 to 5V (pin 32) if you are using a flashrom. Reset is A18 on this diagram. FOR XBOX v1.0/v1.1 The two unused points are only two additional Adress-Lines for the Chip (with which you can access everything beyong 256 kByte) ... so they are NOT needed. FOR XBOX v1.2/v1.3 (Thanks to D-BlooD who posted this diagram on forums.xbox-scene.com) FOR XBOX v1.4/v1.5 (Thanks to pcmerc who posted this diagram on forums.maxconsole.com) WE is the location you jump on the bottom of the board along with the other point on top that is standard on all motherboards. These are the write enable for reflashing the TSOP. Pad 33 is also known as link to 32 in previous pinouts.