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Only recently ive been looking at this manufacturing proces part where they get the kernel on the motherboard. "our" Blake Clements @OGXbox Admin linked me at facebook to the following url: http://www.ogxbox.com/archive/xboxsecurity.html look at the Modchip part. It states that But I do not know if this is said based on the observation mentioned or based on internal Microsoft or flextronics manufacturing personal. Blake also said that: So, the LPC port was used for programming? A bed of nails (pogo pins) should and probably be used to connect the write enable pins on the motherboard to enable the flash writing of the then onboard tsop. I do not know for sure if this is posible but I rather for now asume it was. because we cant flash tsop today whne the xbox has been booted from LPC (modchip boots can only flash modchip, not the tsop, even of you remove the modchip prior to flashing) Connecting to lpc and connecting the write enable lines using pogopins could be done, altho I dont know how they would write to flash from LPC. the MCPX doesnt allow flash write in a LPC boot right? maybe a unkown mode? anyway, pure onboard tsop writing by connecting to the tsop directly would be a pain, but posible with fine pitched pins. not sure if the board would allow that with the mcpx on the same wires. All logic I can come up with is that MS would send their kernel to the tsop manufactorer and let them preprogram all tsops before soldering. then at the factory MS could use a bed of pogopins and a "recovery disk" to install a newer kernel if they wanted as long as the xbox booted from tsop. any other sources or interviews that claim or verify either side are welcome. movies and pictures of this proces too. most details I know came or will be added to: http://xboxdevwiki.net/Manufacturing_Process