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Lifted D0 Pad.


Flowlance
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So it seems like I attempted something I shouldn't when installing the aladdin chip. After soldering the wire to the pad, I did the wiggle test and it came loose, including the pad itself. The Xbox still seems to operate normally. Is it broken now? There's (obviously) no continuity on this trace now.

 

Is there anywhere else I can solder D0 to ground?

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At first you need to repair te trace,  this can be done with a single strand of a wire. 

Second you can use the via on the end of the trace for the connection of d0. 

 

Please make sure your soldering iron is not to hot, this is mostly the cause of lifting pads. 

Make sure to use a good flux,  less heat is needed for soldering then. 

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4 hours ago, Wouter A said:

At first you need to repair te trace,  this can be done with a single strand of a wire. 

Second you can use the via on the end of the trace for the connection of d0. 

 

Please make sure your soldering iron is not to hot, this is mostly the cause of lifting pads. 

Make sure to use a good flux,  less heat is needed for soldering then. 

 

Thanks for the advice. Do you know if I need to fix it at all, since it boots up just fine? I grounded from D0 on the Aladdin chip instead, and it seemed to work.

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