Aero_105 Posted April 22, 2021 Report Share Posted April 22, 2021 Need a second option. Is the trace to solder point missing ok to leave as is? It does not look like a via. So I think I am ok. The original xbox has a modchip. I was attempting to TSOP so I could use the modchip on a v1.6 xbox. When bridging the solder with tinned wire after I gave it a tug to check if it was attached properly and it was enough to rip out the trace and solder point. Quote Link to comment Share on other sites More sharing options...
SS_Dave Posted April 22, 2021 Report Share Posted April 22, 2021 If you link the 2 arrows on the bottom that should get you sorted Cheers SS Dave Soft modding is like masturbating, It gets the job done but it's nothing like the real thing. Quote Link to comment Share on other sites More sharing options...
KaosEngineer Posted April 22, 2021 Report Share Posted April 22, 2021 7 hours ago, Aero_105 said: Need a second option. Is the trace to solder point missing ok to leave as is? Yes. There are alternate locations that connections can be made to write-enable the TSOP. See: https://www.xbmc4xbox.org.uk/forum/viewtopic.php?t=1822 Quote Link to comment Share on other sites More sharing options...
sweetdarkdestiny Posted April 22, 2021 Report Share Posted April 22, 2021 Next time use a multimeter. And you could also bridge the one pad to the via https://imgur.com/a/ZCkBbn0 Quote Link to comment Share on other sites More sharing options...
SS_Dave Posted April 22, 2021 Report Share Posted April 22, 2021 7 minutes ago, sweetdarkdestiny said: Next time use a multimeter. Yes Boss Cheers SS Dave Soft modding is like masturbating, It gets the job done but it's nothing like the real thing. 1 Quote Link to comment Share on other sites More sharing options...
Aero_105 Posted April 22, 2021 Author Report Share Posted April 22, 2021 Lots of options to go by. I'll have to get better practice on tinning vias and solder pads. The solder iron seems to collect the solder from the already tinned solder pads. How do you properly tin vias and solder pads? One article (below link) suggested the solder flows to where heat is. So I must allow the iron to heat the solder point for a few seconds but not enough to damage the board. I have no difficulty tinning wires. Do I solder the wire and allow the heat and solder to flow to the solder point? I use a ST7 (.8mm) solder tip. Have same problem: https://www.quora.com/Every-time-I-try-to-tin-a-solder-pad-the-solder-gets-stuck-to-the-soldering-pencil-instead-How-can-I-prevent-this-and-do-it-correctly How to solder vias: a bit lengthy video but it is helpful. https://www.youtube.com/watch?v=5P7bDsHVsV4 Quote Link to comment Share on other sites More sharing options...
Aero_105 Posted April 23, 2021 Author Report Share Posted April 23, 2021 I was able to resolder the TSOP point I twisted half the stranded wires to makes a smaller wire where I tinned and bridged from the solder pad then to the SMD resistor where the trace broke off. I checked with a multimeter and used bios checker to see if it can recognize the chip. Being a Winbond chip I used XBlast OS program to see if it can read the chip and to get setup to flashing the chip. Quote Link to comment Share on other sites More sharing options...
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