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I have completely taken apart a 1.0 system and removed the clock capacitor, cleaned the CPU, GPU and both heat sinks and reinstalled them with good quality thermal paste. I intend on TSOPing this system. I know it has to be soft modded first. I’d like to solder the two points on the board to unlock write capability of the EEPROM while the system is apart. Is it okay to do this , then put the system back together, do the Softmod and finally the TSOP flash? Or do I have to put the system back together and do the Softmod before I solder the points on the board? Thanks for your help.
I rebuilt the LPC port on my Xbox v1.6 today and had kind of a tough time with it, so I'm curious what everyone else uses to mod their consoles; type of wire, flux, solder, soldering iron/station, soldering tip, soldering temperature, cleaning solution, etc. I used some 30AWG wire-wrapping wire from Amazon, an Aoyue 937+ with the fine tip that came with it, RadioShack rosin flux paste, and RadioShack 62/36/2 rosin-core solder. I've soldered quite a few 0.1" headers on microcontroller and FPGA development kits with great success, but their pads were like twice as thick as those on the Xbox's LPC port. I had a hell of a time getting the pads to heat so that the solder would flow nicely. I also ended up burning the solder mask in a couple of places where I left the tip on too long trying to get the pads heated. Fortunately it still seems to work, but the joints look pretty bad. I think part of the problem was the fine solder tip, but I didn't have much luck with a chisel tip either.
Board Life Status
Board startup date: April 23, 2017 12:45:48