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I have completely taken apart a 1.0 system and removed the clock capacitor, cleaned the CPU, GPU and both heat sinks and reinstalled them with good quality thermal paste. I intend on TSOPing this system. I know it has to be soft modded first. I’d like to solder the two points on the board to unlock write capability of the EEPROM while the system is apart. Is it okay to do this , then put the system back together, do the Softmod and finally the TSOP flash? Or do I have to put the system back together and do the Softmod before I solder the points on the board? Thanks for your help.